PCB completion check Check List

xiaoxiao2021-03-06  55

PCB completion check Check List

1. Connection check, confirm that all NETs have been connected

Using the NetList Compare function of Protel, because this feature does not support the check relationship for the Plane layer, a trick is required. Setting the colors of other layers to black, leaving only the color of the connection, and where to see where there is a problem. In addition, you must select the power supply and the formation for connection check.

2, the inspection of the silk screen. Make sure the size of the silk screen (Height 28, Width 5) Do not print on the pad, nor does it allow the silk screen to be near the pad (due to the production error of the silk screen, if the silk screen is too close, it may be printed Pad on the pad)

3, DRC error check, can use the same method, check the problem of the spacing

4. There is conflict between the spatial size between components, especially near connector.

5. Is the component package suitable for hand-welded. The difference and direction of the Femle and Male is divided for the D-type connector.

6, the diagonal of the BGA device needs to place Mark Point

7, silk screen on the board, the positive and negative of the battery, the name of the plug-in signal, the position of the pin 1

8. If the four angle needs to install the hole, check the position, diameter, and surrounding space of the mounting hole.

9. Making documentation. In the document, the line width, spacing, laminated order, via holes are used, and whether the via surface is covered with the solder welding, whether there is a BGA and BGA overfo, solder welding color, welding Treatment (tinned or nickel gold) edge cutting requirements, thickness, file type, number of production, delivery time. (It is best to make a table, fill in when used)

project

value

Line width

5 mil

spacing

6 mil

Layer number

10th floor

Laminated order

(1, 2 layer signal), (3-layer power supply), (4, 5, 6, 7 signal), (8-layer power supply), (9, 10 layer signal), 3, 10 layers are 1 layer of the Plane layer is TOP layer, 10 floors of Bottom

Thick

1.2mm

Inner diameter

12mil

Via outer diameter

20mil

Via surface treatment

Covering blade

BGA

BGA, BGA overhead cover solder welding

Soldering color

green

Pad processing

Nickel gold

Edge requirements

Milling straight

file type

Protel ACSII

delivery time

10 days

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