The CPU radiator is getting bigger and bigger ... When we cleaned health, the teacher will tell us, do not leave the sanitary corner. When we find that the PC work is not very stable, will it consider which accessories of the problem, or the problem of software. When we remove these one one, it will find that the system is still not very stable. At this time, we have no way, often use this cost of replacement accessories. In fact, in some cases here, we still fall into the corner of thinking. And this neglected place, it is often the problem, this is the hard compatibility problem we mentioned. The so-called "hard compatibility" is a general name that we have proposed here, because until now, there is no recognized name that can be clearly expressed in this concept. We use hardware manufacturers because of the standards, the hardware caused by the hardware, the structure is unreasonable, resulting in poor system stability, and even unable to use this phenomenon, collectively referred to as hard compatibility issues. Hard compatibility issues, what are it, how to avoid hard compatibility issues in the purchase of a hard compatibility problem, how to handle it, this article will give you an explanation. The first part, hard compatibility issues, often there? 1. The hard compatibility of CPU heat dissipation and fan is compatible due to the development of large-scale integrated circuits, and the integration of CPU is getting higher and higher. High fever with CPU high-performance accompanying, is our major problem. Since various heat dissipation techniques have been technically competitive. We use the most widely used air-cooled heat and heat as an example. In order to achieve a better heat dissipation effect, some manufacturers use new technologies and improve the process, and have a variety of attempts on the shape. Some types of radiators are relatively special. Born. These standard newly designed designs such that the volume of the fan is likely to exceed the fan space reserved by the motherboard, especially for some compact motherboards, and the problem is particularly prominent.
We look at the motherboard of this mainstream NF2 chipset in the figure, a corner near the CPU slot, filtered capacitance of the motherboard power supply circuit. This is quite limited to the space reserved for the CPU radiator. We look at another perspective, more obvious.
The capacitance in the figure compresses the space for the CPU for the radiator. For such a main board component layout, it is necessary to pay particular attention to the product of the mid-auger in the selection of the CPU radiator. Otherwise, you will encounter a helpless situation. But from another perspective, if you are not a crazy overclocking enthusiast, just to work or learn to use the computer, there is no need to overclock to the unable to control the situation. This is enough to choose a general radiator. 2. The hard compatibility of the graphics card and memory slots or chassis is now in the field of graphics cards, even for a little performance improvement, also designs and craftsmanship. As a result, the graphics card with PCB is not uncommon, especially in the high-end field. When the PCB length of the graphics card is close to even exceeds the width of the entire motherboard PCB, the hard compatibility problem is convex.
As shown in the figure, we can see that the PCB of this graphics card is just in contact with the memory slot. In this way, only the memory is plugged in, and the memory is fixed to the card can be plugged in. To take the memory, you must take the graphics card first. In this case, although it is inconvenient, it is not the worst. Some motherboards, extension lines from the AGP slots, pass through the memory slot. Such consequences is that the PCB long graphics card is not available at all. Because the graphics card directly contradicts the memory slot. This belongs to the serious failure of the motherboard design. As for the hard compatibility of the graphics card and chassis, similar to what we analyze above, that is, the 3.5-inch position of the PCB graphics card and the chassis is inaccuating each other. Such hard compatibility issues are also existed, we don't drew more. 3. The hard compatibility of North Bridge heat sink is currently used in the heat dissipation of the North Bridge chip: one is that the large heat sink is passively dissipated, one is a fan plus a small heat sink, which uses a lot of manufacturers such as heat dissipation. The integration of the North Bridge chip is simpler than the CPU, and the running frequency is not high, the crystal volume is also slightly larger than the CPU, the bare core package. Theoretically heat resistance is higher than CPU. The motherboard must be aging test at high temperature laboratories before leaving the factory. It is guaranteed that there is no problem at extreme temperatures. In general, heat resistance is teaching. In this way, the side wind of the CPU fan is also available at the same time by adding large heat sink. In the case where the main board is stable, the system frequency is stable, there is no overheating problem. Large heat sinks have undoubtedly cause pressure, large North Bridges, hard compatibility problems, which are easy and large or non-standardized CPU radiators, causing the CPU radiator to be installed. 4. South Bridge Switchable The hard compatibility problem caused by the current South Bridge chip has more and more features, support USB, IDE, SATA RAID, and even audio processing DSP, hardware firewall, etc., high integration It is not to be underestimated by fever problems. Using a heat sink for Nanqiao, it has become a popular practice. Some even applied a fan for active heat dissipation. For full-length PCI cards, large heat sinks bring hard compatible hidden dangers. We use the common Creative's Audigy2 series sound card as an example. For such a full-length PCI card, if installed on the PCI close to the South Bridge Swarf, it is easy to cause hard compatibility issues: Insert can't go in. It is still more fortunate to completely plug in, because you can directly understand this problem, avoiding this PCI slot. However, if it seems that it has been inserted into the PCI slot, a slight conflict occurs. The golden finger to the PCI device is not vertically inserted into the PCI slot. This will cause the PCI grooves to be turned on, while burn the PCI slot, burn the South Bridge, and even burn the PCI equipment. This should be particularly paying attention to this. We can choose to change a PCI slot. If your PCI slot is too small or happens to be a full-length PCI device, it is only replaced by a Nanqiao finish. The problem we mentioned is definitely not only on the past old products. On the current new product, there is an emergence of hard compatibility with the South Bridge. A heat sink is applied to the NF4 chip of the South Bridge position in this system using an NF4 chip. Extended PCB graphics card directly "oppression" to the upper side of the radiator, in addition to "Fortunately" did not contradict, we don't know what to say. No matter how you analyze it, the heat dissipation performance of the radiator must be affected. For this helpless design, we hope that will gradually disappear. 5. The hard compatibility problem of power cord and chassis is very well understood. It is necessary to choose a power supply for 1 meter or so, it is very necessary for people who are now increasingly using larger chassis. This will not be seen in the "line". 6. Other hard compatibility issues This type of hard compatibility is only a good enough product that occurs at individual vendors, and does not have universal representations, but it is also objective.
The figure shows a motherboard power supply circuit setting, after the external power supply module is inserted into the main board into the slot of the motherboard, as shown, the two capacitors have occurred once a "intimate contact", which may be caused The capacitance pin is broken, so the problem is not to we ignore. The second part, how to avoid and solve hard compatibility problems to avoid hard compatibility issues between each other, usually from the few aspects we mentioned above. Comprehensive consideration of components of board design, especially component distribution, such as capacitive components, especially in large spaces. Actually considering the distribution of such components to avoid selecting hard compatibility issues that occur with them. Consider the PCB length of your choice, earnestly analyze its requirements for space in the chassis, can be used to make Chengzhu in the chest before choosing, avoiding problems when the problem occurs. Comprehensive consideration of the component distribution characteristics of board design, using this integrated thinking, it is to avoid hard compatibility, (actually a helpless policy, because there is basically no specific standard to ensure no appearance Hard compatibility issues, users can only be judged by their own experience) If there is already this kind of trouble, it doesn't have to worry too much, just solve the following method, for different types of hard compatibility, we It is also necessary to wait for a long time. 1. The hard compatibility problem that can be observed directly is relatively simple to observe the hard compatibility problem that we can observe directly. For a hard compatibility problem that the CPU radiator is too large, the radiator product of the small volume can be replaced. For the hard compatibility of the North Bridge heat sink, we can replace the North Bridge STM, select a small heat sink, and use the wind of the CPU radiator fan to cool. Or use a heat sink with a small fan. For the hard compatibility of components that have more spaced spaces such as capacitors, we can choose a small product replacement of other parameters. When replacing the capacitance, there are several aspects that we need to pay attention: do not lower than the original capacitance, higher than the original capacitance, but the more the amount of pressure, the larger the volume, and the pressure is too high, no necessary . Secondary capacity is not lower than the original capacitance. Generally, heat resistance does not require us to think too much, as long as it is a famous brand capacitor, heat resistance is required. When welding, pay attention to the positive negative pole. On the capacitor, the negative electrode is labeled with a negative number, and generally there is a negative of the white strip print from the top to bottom. On the PCB, there is generally a positive and negative marks, no marked, generally a circle, scaled into two half-gardens, applied to the negative electrode of the color, and the air is the positive pole. 2. Mining hidden hard compatibility issues For intuitive hard compatibility issues, we can all handle, even if we can't process, you should also try to solve the problem in that direction. But there is a kind of hard compatibility problem, it is a wide range of existence, affecting your system's stability, and freshly known, now we mine such concealed hard compatibility issues. We will give two examples ... Example 1: CPU hidden hard compatibility problem.
The tank of the cooling block and the CPU core contact surface is too shallow, so that the protruding portion of the CPU socket is contradiated, resulting in a heat sink heat absorbing surface and the CPU core from being flattened. Thereby, the system is unstable. In the end of the drug-cooled products sold in China, this problem is especially prominent.
As shown, when such hardware compatible problems occur, there is a angle A in the CPU core and the heat absorbing cassette contact surface, so that heat dissipation is greatly reduced, and even criminalizes the core. This is especially important for AMD Athlon XP. How to deal with this situation, we can choose two ways. First, we can consider grinding the heat absorbing cassette. Here is some of our contrast.
In the figure, the tank of the 1 heat absorbing box is deeply grinded, and it can be seen that the groove is deep, which can solve the hard compatibility problem. 2 The heat absorber is not polished, the slot is very shallow, and it is easy to have a hard compatibility problem. The 3 heat absorption box is slightly polished, and the slot is moderate, and the problem can be relieved to a certain extent. 4 is very deep and very standard for the tank of the heat sink of the wind-free radiator. The possibility of hard compatibility issues completely avoided. When you work, choose a small file, and we have introduced below. We can also choose another way to polish the CPU socket. As shown in the figure, cover a piece of paper on the Pin section of the CPU socket and then smoothly poll the protruding portion with a small file. Wash 0.5-1mm. Then clean off the crusher. When cleaning the crumbs, be careful to make the motherboard in one side of the CPU socket, then use a small brush to gently brush, debris will fall to the ground. Example 2: Many people with hidden rigid compatibility with North Bridge have questions, what hard compatibility is hidden in the North Bridge? Let's do a test: We use a widely applying NF2 chip as an example, select a plane of a heat sink, and then apply a heat sink silicone on the North Bridge chip, and then buckle the heat sink on the North Bridge. Gently press, pay attention to not move, what did you find? As shown below:
You will find that there is silicone on the edge of the heat sink, but there is no in the center. Explanation, the heat sink is not in contact with the central position of the North Bridge core. The overhead of the North Bridge also causes the system to unstable or crash. And all of this seems to make you imagine that it is the problem of the North Bridge, so you can't start. Let's start to solve this problem. We can see that this package in the NF2 chip is not absolutely flat, but it seems to be a plane, and the edge is slightly higher. This dark brown is similar to ceramic substance, in fact, not a core, just a core package, and protects the core. The North Bridge chip is in the center of the package. This similar substance similar to ceramics is very hard (probably a special performance of plastic), can be slightly polished, absolutely not damaged to the interior and core. Let's start grinding. As shown in the figure above, use a small file, smooth on the chip. Be careful not to force, prevent the knife from touching the bad other components. After a while, we can find that even if the marking traces appear, the center of the North Bridge chip package is not damaged, which means that it is still low, then continue to polish. Until the center of the center also becomes blurred, it can be stopped at this time. Clean debris after grinding:
