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xiaoxiao2021-03-06  41

ICT, ATE is elemental test based on electrical characteristics, and the difference between ATE and ICT is: 1.ate testing T / U components than ICT;

2.ate can be tested by analog power to test each voltage, and ICT cannot be implemented;

ICT, ATE common disadvantage: 1. Large capacitance and small capacitance parallel, small capacitance cannot Cover, such as 800uf and 100nf; 2. Small resistance and large resistance and latter, large resistance does not Cover; 3. MOS tube parallel, One of Cover; 4. The impact of the space is affected, some functions cannot be realized; 5. Special components cannot be tested, such as temperature control resistance, lightning resistance, etc.

How to stipulate which components use ICT, ATE COVER: Elements that can have test points require access to ICT / ATE tests.

How to define ICT, ATE Cover Rate: The component is in the test, the machine automatically calculates Cover Rate;

Why constantly modify the Coverge, can't be completed once: Cover is constantly increasing. I found the problem and find a way to Cover through everyone's reaction and TE's continuous test.

ICT (In Circuit Test) ATE (Auto Test Equipment)

The Elements of Testing by ICT & ATE ON MOTHERBOARD IS According to ITS Electrical Character. The Different Between ICT AND ATE ATE ATE ATE ATE ATE ATE ATE ATE ATE ATE AS FOLLOW:

1. T / U Components Are Tested by Ate But no ICT.

2. Ate Can Simulate The M / B Power Supply, The Voltage on Specification Point.

The Disadvantage Both in ICT and ATE:

1. Small Capacitance Miss Can't Be Cover When It Parallel Connects with Big Capacitance. For Example When ONE 800UF Parallel Connects with One 100uf, The 100uf Capacitance COULDN '' BE COVERED.

2. As The Same, WHEN A SMALL RESISTANCE PARALLEL WITH A BIG ONE, The Big Resistance Can't Be Covered.

3. IF MOS & FET Parallel with Another, ICT & ATE JUST CAN COVERED WHEN Both of Them Are Fail;

4. Some Functions CAN't Be PerformAnced Limited by The Space of FixTure.

5. Special Component Couldn't Be Tested, Such as Thermal Resistance,

How to Decide The Component Should Test By WHETHER ICT OR ATE:

All The Components Connected with Test Point Should By Test In ICT / ATE.

HOW to Define the coverage of iCt / ate.

Cover Rate Could Be Calculate Automatically (by Machine)

Why need to modify the coverage again and again, can't be finished.

The Competence of Coverage Has Been Advancing Constantly.Based On Ottempt, We Can Found Out The Problem and Try To Solve IT.

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